Method of modifying a surface of a structured wafer

Details Method of modifying a surface of a structured wafer Method of modifying a surface of a structured wafer

B - Operations, Transporting

24

B

B24B 37/04 (2006.01) B24D 3/20 (2006.01) B24D 11/00 (2006.01) H01L 21/321 (2006.01) H01L 21/768 (2006.01)

Patent

CA 2374004

A method of modifying a surface comprising the steps of: (a) contacting the surface to be modified with a working surface (47) of an abrasive article (40), the abrasive article comprising a phase separated polymer (44) having a first phase and a second phase, the first phase being harder than the second phase; and (b) relatively moving the surface to be modified and the fixed abrasive article to remove material from the surface to be modified in the absence of an abrasive slurry.

La présente invention concerne un procédé de modification d'une surface comportant les étapes suivantes: (a) mise en contact de la surface à modifier avec une surface de travail (47) d'un produit abrasif (40), le produit abrasif comportant un polymère en phase distinctes (44) présentant une première phase et une deuxième phase, la première phase étant plus dure que la deuxième phase; et (b) déplacement relatif de la surface à modifier et le produit abrasif fixe en vue d'enlever de la matière de la surface à modifier en l'absence d'une barbotine abrasive.

Affiliated with

Also associated with

Rating

Method of modifying a surface of a structured wafer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of modifying a surface of a structured wafer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of modifying a surface of a structured wafer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1688036