B - Operations – Transporting – 29 – C
Patent
B - Operations, Transporting
29
C
B29C 45/26 (2006.01) B29C 45/00 (2006.01)
Patent
CA 2063997
2063997 9119600 PCTABS00008 A method of forming a module cover (1) high in strength and easily torn open along a tear line (1A), in which gates (13A, 13B, 13C, and 13D) are provided in at least two of a plurality of sectioned zones in the cavity each defined by ridge-like projections (12a, 12b, and 12c) of a metallic mold (11) for formation of the tear line, whereby resin is injected through these gates (13A, 13B, 13C, and 13D) into the cavity in parallel rows.
Nanbu Yuichi
Sawada Masami
Zushi Takayasu
Nanbu Yuichi
Sawada Masami
Seaby & Associates
Takata Corporation
Zushi Takayasu
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