G - Physics – 01 – N
Patent
G - Physics
01
N
G01N 11/00 (2006.01) G01N 11/08 (2006.01)
Patent
CA 2209104
The yield stress of rheologically plastic fluids such as coatings, sealants, and personal care lotions, determines their tendency to flow at low gravitational stress. Yield Stress is the apparent threshold stress above which flow is observed on an arbitrary time scale. An on-line technique to monitor yield stress during processing was developed herein and is used in controlling the slump or non-slump behavior of such products. A residual stress, after a flow excursion returns to zero shear rate, is related to yield stress. This residual stress is used for process monitoring. It is measured from the residual pressureor torque after a controlled strain rheometer reaches zero strain rate.
Deleeuw David Charles
Langley Neal Roger
Dow Corning Corporation
Gowling Lafleur Henderson Llp
LandOfFree
Method of monitoring and controlling yield stress does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of monitoring and controlling yield stress, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of monitoring and controlling yield stress will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-2032523