Method of mounting a chip on a flexible foil substrate for...

H - Electricity – 01 – L

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

H01L 21/50 (2006.01) G02B 6/42 (2006.01) H01L 21/56 (2006.01) H01L 23/13 (2006.01) H01L 23/498 (2006.01)

Patent

CA 2238754

With the invention of simplifying an arrangement of a chip having at least one optical active surface and positioning the chip in a correct position in relation to an optical miniature capsule for optimum light transmission between an optical fibre and the optically active surface, the chip (1) is fastened on a foil substrate (9) which has at least one conductor (4) and which is provided with alignment marks and/or guide means (8) for correct positioning of the chip on the foil substrate and for correct positioning of the foil substrate/chip assembly on the capsule. After having fastened the chip on the foil substrate, the foil with the chip can be readily fastened to the capsule and by that means the chip will be fastened to the capsule. By using guide means, for instance contact element guide pins on the capsule, the foil substrate/chip assembly can be positioned correctly in relation to the capsule, such that the ends of the optical fibres in the contact element will lie opposite to and in contact with the optically active surfaces of the chip and therewith provide optimum light transmission.

L'invention concerne un système simplifié de puce ou pastille ayant au moins une surface optiquement active et un procédé pour placer la pastille dans une position correcte par rapport à une capsule optique miniature, afin d'assurer une transmission de lumière optimale entre une fibre optique et la surface optiquement active, la pastille (1) est fixée sur une feuille de substrat (9) qui a au moins un conducteur (4) et qui est pourvue de marques d'alignement et/ou de moyens de guidage (8) pour assurer le positionnement correct de la pastille sur la feuille de substrat et pour assurer le positionnement correct de l'ensemble pastille/feuille de substrat sur la capsule. En utilisant un moyen de guidage, par exemple les broches de guidage de l'élément de contact sur la capsule, l'ensemble pastille/feuille de substrat peut être positionné correctement par rapport à la capsule, afin que les extrémités des fibres optiques dans l'élément de contact soient en face et en contact avec les surfaces optiquement actives de la pastille, pour assurer une transmission de lumière optimale.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Method of mounting a chip on a flexible foil substrate for... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of mounting a chip on a flexible foil substrate for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of mounting a chip on a flexible foil substrate for... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1345535

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.