Method of mounting a piezoelectric element to a substrate

Details Method of mounting a piezoelectric element to a substrate Method of mounting a piezoelectric element to a substrate

H - Electricity

01

L

H01L 41/053 (2006.01) H03H 9/05 (2006.01) H03H 9/10 (2006.01)

Patent

CA 2151510

A method of mounting a piezoelectric element (102) with a substrate (106). First, a compliant material is dispensed on at least one side of the substrate and cured. Next, a first conductive adhesive (112) is applied on the other side of the substrate. Third, a piezoelectric element is positioned over the substrate. Thereafter, a second compliant conductive adhesive (113) is selectively dispensed such that it contacts an upper portion of one side of the piezoelectric element and the substrate.

L'invention se rapporte à un procédé de montage d'un élément piézo-électrique (102) sur un substrat (106). En premier, on dépose sur au moins un côté du substrat un matériau déformable que l'on cuit. Puis, on applique un premier adhésif conducteur (112) sur l'autre côté du substrat. Troisièmement, on place un élément piézo-électrique par-dessus le substrat. Enfin, on dépose de manière sélective un second adhésif conducteur (113), déformable, de telle sorte qu'il entre en contact avec une portion supérieure d'un des côtés de l'élément piézo-électrique et du substrat.

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