Method of mounting components to facilitate cooling

H - Electricity – 05 – K

Patent

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Details

H05K 7/20 (2006.01)

Patent

CA 2244702

An apparatus for cooling heat dissipating components in an electronic circuit, the apparatus includes an enclosure, a duct, and a fan. The enclosure houses the heat dissipating components, the enclosure and has an air inlet and an air outlet. The duct is disposed inside the enclosure and at least one of the heat dissipating components is mounted in the duct. The duct includes at least one wall, including a heatsink to which at least one of the heat dissipating components is mounted. The fan is proximate the duct for drawing air from outside the enclosure through the inlet, through the duct to impart heat from the heat sink and the component mounted in the duct to the air and for forcing the air out of the enclosure through the air outlet.

La présente invention a pour objet un dispositif assurant le refroidissement de composants utilisés aux fins de dissipation thermique dans un circuit électronique. Le dispositif en question est composé d'une enveloppe, d'un conduit et d'un ventilateur. L'enveloppe renferme les composants utilisés aux fins de dissipation thermique et comporte un orifice d'entrée d'air et un orifice de sortie d'air. Le conduit est disposé à l'intérieur de l'enveloppe et loge au moins un des composants utilisés aux fins de dissipation thermique. Le conduit comporte au moins une paroi sur laquelle au moins un des composants utilisés aux fins de dissipation thermique est monté. Le ventilateur est monté à proximité du conduit et sert à y aspirer l'air de l'extérieur par l'orifice d'entrée d'air et à travers le conduit pour transférer au courant d'air la chaleur du dissipateur thermique et des composants montés à l'intérieur du conduit avant de refouler cet air vers l'extérieur à travers l'orifice de sortie.

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