Method of mounting electronic components

Details Method of mounting electronic components Method of mounting electronic components

B - Operations, Transporting

23

P

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B23P 11/00 (2006.01) B23P 19/00 (2006.01) B23P 21/00 (2006.01) H05K 3/30 (2006.01)

Patent

CA 1129184

Abstract A method of mounting electronic components on a printed circuit board by temporarily attaching the electronic component to the circuit board with adhesive applied to the board, irradiating the adhesive with ultra- violet rays with or without heating to cure the adhesive and thereby rigidly attach the component to the board, and thereafter joining the electrodes of the component to conductor portions on the board. Excess adhesive portions adjoining the component are cured first to subsequently cure the other portion of the adhesive in chain relation to the curing of the excess.

347225

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