Method of mounting semiconductor elements

Details Method of mounting semiconductor elements Method of mounting semiconductor elements

H - Electricity

05

K

H05K 3/34 (2006.01) H01L 21/60 (2006.01)

Patent

CA 2055845

ABSTRACT OF THE DISCLOSURE A method of mounting a plurality of semiconductor elements each having bump electrodes on a wiring board by pressing the semiconductor elements to the wiring board while aligning the electrodes and heating the structure. In the mounting method, one or more heat sinks are previously joined to the backs opposite to the surfaces with the bump electrodes formed thereon of the semiconductor elements. - 13 -

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