Method of nodularizing a metal surface

Details Method of nodularizing a metal surface Method of nodularizing a metal surface

C - Chemistry, Metallurgy

25

D

204/15, 204/36

C25D 3/38 (2006.01) C25D 5/16 (2006.01) C25D 7/06 (2006.01) H05K 3/38 (2006.01) H05K 3/02 (2006.01)

Patent

CA 1044636

Abstract of the Disclosure A method of nodularizing a metal surface, e.g., a copper, copper alloy or nickel surface, by electroplating the surface with copper from a copper sulfate plating solution containing nitrate ions. The nodules formed are generally spherical and are firmly attached to the underlying metal surface and assist in mechanically locking it to another mem- ber, for example, the resinous substrate used in forming a printed circuit board.

216635

Affiliated with

Also associated with

Rating

Method of nodularizing a metal surface does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of nodularizing a metal surface, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of nodularizing a metal surface will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-80941