H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 1/03 (2006.01) H01L 23/14 (2006.01) H01L 23/538 (2006.01) H01L 23/66 (2006.01) H05K 1/16 (2006.01) H05K 3/02 (2006.01)
Patent
CA 2050359
ABSTRACT OF THE DISCLOSURE Integration and packaging of monolithic microwave integrated circuits (MMIC) components is facilitated by using a motherboard comprising high resistivity silicon, which having a thermal conductivity three times that of gallium arsenide. Ultra high purity, uncompensated silicon preferably is used. Anisotropic etching of recesses in the motherboard facilitates precise place- ment of the MMICs in the recesses, enabling use of automated die and wire bonding techniques to reduce required assembly time substantially. Using a silicon motherboard also ultimately enables incorporation of required control circuitry. The silicon motherboard also transmits RF energy well, a useful characteristic particularly in C-band and X-band applications in which microstrip is used, though other transmission media function well at even higher frequencies.
Geller Bernard D.
Holdeman Louis B.
Laird George F. III
Phelleps Fred R.
Tyler Johann U.
G. Ronald Bell & Associates
Geller Bernard D.
Holdeman Louis B.
Laird George F. III
Phelleps Fred R.
LandOfFree
Method of packaging microwave semiconductor components and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of packaging microwave semiconductor components and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of packaging microwave semiconductor components and... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1889330