Method of packaging microwave semiconductor components and...

H - Electricity – 05 – K

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H05K 1/03 (2006.01) H01L 23/14 (2006.01) H01L 23/538 (2006.01) H01L 23/66 (2006.01) H05K 1/16 (2006.01) H05K 3/02 (2006.01)

Patent

CA 2050359

ABSTRACT OF THE DISCLOSURE Integration and packaging of monolithic microwave integrated circuits (MMIC) components is facilitated by using a motherboard comprising high resistivity silicon, which having a thermal conductivity three times that of gallium arsenide. Ultra high purity, uncompensated silicon preferably is used. Anisotropic etching of recesses in the motherboard facilitates precise place- ment of the MMICs in the recesses, enabling use of automated die and wire bonding techniques to reduce required assembly time substantially. Using a silicon motherboard also ultimately enables incorporation of required control circuitry. The silicon motherboard also transmits RF energy well, a useful characteristic particularly in C-band and X-band applications in which microstrip is used, though other transmission media function well at even higher frequencies.

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