H - Electricity – 05 – K
Patent
H - Electricity
05
K
217/126, 156/7
H05K 5/00 (2006.01) H05K 13/00 (2006.01)
Patent
CA 1222225
METHOD OF PACKING ELECTRONIC PARTS AND A PACK PRODUCED BY THE METHOD ABSTRACT OF THE DISCLOSURE A method of pakcing electronic parts. Electronic parts are inserted into a plurality of containers each of which has an opening on the upper surface thereof. Said containers are juxtaposed side by side. A single common pressing plate is disposed over said containers so as to cover their openings. Said containers and said pressing plate are packed together in a sack under vacuum.
374514
Ishihara Michio
Kuboyama Makoto
Oishi Hiroshi
Fujitsu Limited
Mcfadden Fincham
LandOfFree
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