Method of preparing a printed substrate

Details Method of preparing a printed substrate Method of preparing a printed substrate

C - Chemistry, Metallurgy

23

C

C23C 18/54 (2006.01) C23C 2/02 (2006.01) C23C 18/48 (2006.01) H05K 3/24 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2056218

ABSTRACT A method of preparing a printed substrate comprises forming a wiring pattern on a substrate and a coating a solder alloy including tin and lead as major components on the wiring pattern by means of electroless plating.

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