Method of preparing an electrical insulation film and...

C - Chemistry – Metallurgy – 09 – D

Patent

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Details

C09D 5/44 (2006.01) C25D 7/12 (2006.01) C25D 13/04 (2006.01) C25D 13/08 (2006.01) H01L 21/02 (2006.01) H01L 21/288 (2006.01) H01L 23/52 (2006.01)

Patent

CA 2728498

The present invention relates essentially to a method of preparing an electrical insulating film on the surface of an electrically conducting or semi­conducting substrate, such as a silicon substrate. According to the invention, this method comprises the following: a) said surface is brought into contact with a liquid solution comprising: a protic solvent, at least one diazonium salt, at least one in-chain polymerizable monomer soluble in said protic solvent, and at least one acid in an amount sufficient to stabilize said diazonium salt by adjusting the pH of said solution to a value below 7, preferably below 2.5; and b) said surface is polarized in pulse potentiostatic or galvanostatic mode for a time sufficient to form a film having a thickness of at least 60 nanometres, and preferably between 80 and 500 nanometres. Application: metallization of through-vias, especially for 3-D integrated circuits.

La présente invention concerne essentiellement un procédé de préparation d'un film isolant électrique à la surface d'un substrat conducteur ou semiconducteur de l'électricité, tel qu'un substrat de silicium. Selon l'invention, ce procédé comprend : a) la mise en contact de ladite surface avec une solution liquide comprenant : un solvant protique; au moins un sel de diazonium; au moins un monomère polymérisable en chaîne et soluble dans ledit solvant protique; au moins un acide en une quantité suffisante pour stabiliser ledit sel de diazonium par ajustement du pH de ladite solution à une valeur inférieure à 7, de préférence inférieure à 2,5; b) la polarisation de ladite surface selon un mode potentio- ou galvano-pulsé pendant une durée suffisante pour former un film présentant une épaisseur d'au moins 60 nanomètres, et de préférence comprise entre 80 et 500 nanomètres. Application : Métallisation de vias traversants, notamment de circuits intégrés 3D.

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