C - Chemistry – Metallurgy – 08 – J
Patent
C - Chemistry, Metallurgy
08
J
C08J 7/14 (2006.01) B05D 3/10 (2006.01) H05K 9/00 (2006.01)
Patent
CA 2072398
RD-21,551 METHOD OF PREPARING POLYMER SURFACES FOR SUBSEQUENT PLATING THEREON AND IMPROVED METAL-PLATED PLASTIC ARTICLES MADE THEREFROM Abstract of the Disclosure Method of modifying an aromatic polymer surface to improve adhesion of a metal layer thereon and to the articles produced therefrom. The surface of the aromatic polymer such as polycarbonate, is nitrated by a contact with a nitrating solution such as a mixture of nitric and sulfuric acid and then hydroxylated by a contact with a hydroxylating solution such as ammonium hydroxide. The hydroxylated surface is thus chemically modified to become hydrophilic. The chemically modified surface is electrolessly plated with a primary metal layer. A secondary metal layer is then electrolessly or electrolytically applied on top of the primary metal layer until a metal layer of a desired thickness is attained. The present invention further discloses articles such as an EMI shielded enclosure or a printed circuit board having metal layers as an EMI shield or a conductive metal trace pattern respectively.
Company General Electric
Craig Wilson And Company
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