Method of preparing thermally conductive compounds by liquid...

C - Chemistry – Metallurgy – 08 – K

Patent

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C08K 9/10 (2006.01) H01L 23/373 (2006.01)

Patent

CA 2343504

A thermally conductive mechanically compliant pad including a quantity of gallium and/or indium alloy liquid at temperatures below about 120°C and a boron nitride particulate solid blended into the liquid metal alloy to form a paste. The paste is then combined with a quantity of a flowable plastic resin such as silicone oil to form the mechanically compliant pad, the compliant pad comprising from between about 10% and 90% of metallic coated particulate, balance flowable plastic resin.

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