Method of preparing thermally conductive compounds by liquid...

Details Method of preparing thermally conductive compounds by liquid... Method of preparing thermally conductive compounds by liquid...

C - Chemistry, Metallurgy

08

K

C08K 9/10 (2006.01) C08J 3/20 (2006.01) C08K 5/5415 (2006.01) C08L 83/04 (2006.01)

Patent

CA 2343486

A thermally conductive mechanically compliant pad of high stability including a quantity of gallium and/or indium alloy liquid at temperatures below about 120°C and a boron nitride particulate solid blended into the liquid metal alloy to form a paste. The paste is then combined with a quantity of a flowable plastic resin consisting of a blend of silicone oil and octyl-ethoxysilane-to form the mechanically compliant pad, the compliant pad comprising from between about 10% and 90% of metallic coated particulate, balance flowable plastic resin blend.

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