Method of producing a circuit board

Details Method of producing a circuit board Method of producing a circuit board

H - Electricity

05

K

356/22, 347/48

H05K 1/11 (2006.01) H05K 3/20 (2006.01) H05K 3/28 (2006.01) H05K 3/30 (2006.01)

Patent

CA 1074923

ABSTRACT OF THE DISCLOSURE Circuit boards are produced using a perforated polyethy- lene sheet by filling the perforations in the sheet with grease, placing a frame on the sheet to form a mold, mounting electrical components on the sheet by inserting the leads of the components into the perforation, applying a layer of sand to the mold surrounding the component leads but not completely covering the components, and pouring an epoxy resin into the mold, the resin mixing with the sand and filling the mold, whereby the resulting circuit board includes a solid epoxy and and body with connec- tors and component leads on one surface and electrical compo- nents projecting outwardly from the other surface thereof.

296019

Affiliated with

Also associated with

Rating

Method of producing a circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of producing a circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of producing a circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-569907