Method of producing circuit boards using adhesive coating

Details Method of producing circuit boards using adhesive coating Method of producing circuit boards using adhesive coating

H - Electricity

05

K

356/16

H05K 3/38 (2006.01) H05K 3/46 (2006.01)

Patent

CA 1162323

595-RG-054 ABSTRACT A method for producing circuit boards and circuit boards produced thereby in which a plurality of planar circuit board bases having a circuit pattern thereon are interconnected at predetermined points. The method includes the steps of applying a mask over the circuit pattern on a base leaving, at the points to be interconnected, a window in the mask; applying an adhesive coating over the mask with the adhesive coating extending over the mask windows and onto the circuit pattern metal to form a second smaller window; treating and depositing metal on said adhesive coating to form a second circuit pattern on the plane of said adhesive and interconnecting the second circuit pattern with the first circuit pattern at said second windows;and,repeat- ing said steps until a circuit board of the desired number of planar circuit patterns is produced.

371147

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