Method of producing copper alloy layers and patterns on...

Details Method of producing copper alloy layers and patterns on... Method of producing copper alloy layers and patterns on...

D - Textiles, Paper

06

F

6/4, 117/80

D06F 75/14 (2006.01) D06F 75/28 (2006.01) D06F 75/34 (2006.01)

Patent

CA 1168001

ABSTRACT Method of and solution for the electroless deposi- tion of copper with an improved ductility. This is accom- plished by building-in one or more of the metals Ni, Co, Fe, Pt, Pd) Rh, Ru and Ir, a complex-forming agent being chosen from the group of nitrilo-tri-2-propanol, tri-ethanol amine and a combinat on of cyanide and ethylene diamine tetra- acetic acid so that, if Ni, Co or Fe is used as the alloying component cupric ions are bound more strongly than the ions of these alloying components and, if the remaining metals of the above-mentioned metals are chosen the ions of these last-mentioned metals are bound more strongly than cupric ions.

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