Method of producing grain oriented silicon iron plate of low...

C - Chemistry – Metallurgy – 21 – D

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148/8

C21D 8/12 (2006.01)

Patent

CA 1314461

ABSTRACT OF THE DISCLOSURE With respect to a grain oriented silicon iron plate contain- ing Si of more than 1.0 wt% to less than 4.0 wt% and having a (110)<001> aggregate structure, by passing through the steps of removing oxidized films from the surface thereof, heating to temperatures of 1000 to 1250°C, siliconizing by contacting to an atmospheric gas bearing SiC14 of 5 to 40 vol%, subjecting to diffusion uniformalization annealing in a protecting atmospheric gas at temperatures of 1000 to 1400°C and coating, after cooling, an isolation film thereon, the invention produces such a grain oriented silicon iron plate containing the Si content of 4.0 to 7.0 wt%.

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