H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/1
H05K 3/06 (2006.01) C23C 14/04 (2006.01) H05K 3/14 (2006.01)
Patent
CA 1111144
METHOD OF PRODUCING MATERIAL PATTERN Abstract of the Disclosure The specification discloses a method of producing patterns of a material on a substrate. In this method, a mask is located over the substrate and both elements are fixed in a substrate holder. An evaporated film of the desired material is formed on the surface of the substrate by means of an evaporation source provided to confront the substrate through the mask. The mask is formed with a plurality of reinforcing bridges located in desired portions of the mask openings. The mask is held spaced from the substrate by a small distance during the evapora- tion, so that the evaporation may be effected through at least two pattern openings defined on opposite sides of each bridge. The evaporation is performed by means of evaporation sources which are located such that a line interconnecting one of the edges of each bridge and an evaporation source located on the open side of said edge and another line interconnecting the other edge of the bridge and an evaporation source located on the open side of said other edge intersect each other at a point on the surface of the substrate or in the clearance between the substrate surface and the mask. This method makes it possible to produce patterns of complex shape which could not be produced by the conventional evaporation method.
320564
Maruyama Eiichi
Matsumaru Haruo
Nakano Toshio
Sasano Akira
Tsutsui Ken
Hitachi Ltd.
Kirby Eades Gale Baker
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