H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 21/28 (2006.01) B01J 4/02 (2006.01) B01J 19/00 (2006.01) B01L 3/00 (2006.01) F04B 19/00 (2006.01) H01L 21/77 (2006.01) H02N 11/00 (2006.01) H05K 3/10 (2006.01) B01F 5/06 (2006.01)
Patent
CA 2223166
The present invention provides a method of forming a fluid-tight electrical conduit through a high aspect ratio hole, the method comprising sintering a via ink to form the electrical conduit and to seal the hole.
La présente invention concerne un procédé de fabrication d'un conduit électrique étanche aux fluides à travers un trou présentant un rapport diamètre/profondeur élevé, ledit procédé consistant à effectuer un frittage avec une pâte pour trous d'interconnexion de façon à former le conduit électrique et à obturer le trou.
Braun Paul L.
Burton Charlotte A.
Demers Robert R.
Mcbride Sterling E.
Quinn Robert Leon
David Sarnoff Research Center Inc.
Gowling Lafleur Henderson Llp
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