Method of producing multilayer circuit boards, a fixed...

Details Method of producing multilayer circuit boards, a fixed... Method of producing multilayer circuit boards, a fixed...

H - Electricity

05

K

356/16

H05K 1/02 (2006.01) H05K 3/00 (2006.01) H05K 3/46 (2006.01)

Patent

CA 1224884

- 14 - Abstract Method of producing multilayer circuit boards, a fixed layered structure produced by this method, and the use of this layered structure in this production method. In this method for the production of multi- layer circuit boards the layered structure comprising laminates and prepregs is already joined together, be- fore the curing operation, with the aid of mechanical connection means in such a manner that the laminates are fixed relative to one another, preferably with a material-to-material connection. The layered structure itself is thus charac- terized in that it is joined together with the aid of mechanical connection elements (5) in such a manner that the laminates (1, Z) are fixed relative to one another by the connection elements (5).

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