Method of producing nozzles in monocrystalline silicon wafer

Details Method of producing nozzles in monocrystalline silicon wafer Method of producing nozzles in monocrystalline silicon wafer

G - Physics

01

D

149/10, 299/28,

G01D 15/18 (2006.01) B41J 2/16 (2006.01) C03B 9/33 (2006.01)

Patent

CA 1037519

METHOD OF PRODUCING NOZZLES IN MONOCRYSTALLINE SILICON WAFER ABSTRACT OF THE DISCLOSURE Method for producing a predetermined pattern of small size fluid nozzles of identical or different geometries in crystallographically oriented monocrystalline silicon or similar material utilizing anisotropic etching through the silicon to an integral etch resistant barrier layer heavily doped with P type impurities.

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