Method of providing a metal layer on a substrate

Details Method of providing a metal layer on a substrate Method of providing a metal layer on a substrate

C - Chemistry, Metallurgy

23

C

117/82

C23C 10/02 (2006.01) C03C 17/38 (2006.01) C23C 14/02 (2006.01) G02B 1/10 (2006.01) G11B 23/00 (2006.01)

Patent

CA 1219180

ABSTRACT "Method of providing a metal layer on a substrate." A method of providing a metal layer on a substrate having an ultra-smooth or microprofiled surface, in which the surface structure is reproduced in the metal layer. On the substrate surface which is hy- drophilic or is made hydrophilic, preferably a monomolecular layer of alkoxysilylalkylthiol, an alkoxysilylalkylamine or a chlorosilylalkyl- thiol is provided as a bonding intermediary in a layer which is at most 15 molecules thick by contact with an atmosphere in which said substance is present in a vapour form. The metal layer is vapour-deposited thereon in a thickness of 50-300 nm.

442705

Affiliated with

Also associated with

Rating

Method of providing a metal layer on a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of providing a metal layer on a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of providing a metal layer on a substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1310140