Method of providing conductive tracks on a printed circuit...

H - Electricity – 05 – K

Patent

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H05K 3/24 (2006.01) C25D 5/02 (2006.01) C25D 5/06 (2006.01)

Patent

CA 2327574

A method of providing conductive tracks (14) on a printed circuit (10) by electro-plating conductive tracks (14) which have been produced by printing them onto a substrate (12), comprising coating a substrate (16) carrying the printed tracks (14) with an electro-plating solution (18) using a tool which provides a first electrode of an electro-plating circuit and with a second electrode provided by the tracks (14) which are to be electroplated.

L'invention concerne un procédé permettant de doter un circuit imprimé (10) de pistes conductrices (14), ce procédé consistant à soumettre ces pistes conductrices (14) à un processus d'électrodéposition, ces pistes ayant par ailleurs été fabriquées par impression sur un substrat (12). Le procédé de cette invention consiste également à enrober un substrat (12) pourvu des pistes susmentionnées avec une solution d'électrodéposition (18), à l'aide d'un outil permettant de doter un circuit d'électrodéposition d'une première électrode, la seconde électrode étant constituée par les pistes (14) destinées à être soumises à un processus d'électrodéposition.

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