Method of providing raised contact portions on contact areas...

Details Method of providing raised contact portions on contact areas... Method of providing raised contact portions on contact areas...

H - Electricity

05

K

356/184

H05K 3/40 (2006.01) H01L 21/60 (2006.01) H01L 21/603 (2006.01) H01L 21/607 (2006.01) H01L 23/485 (2006.01)

Patent

CA 1181534

ABSTRACT : "Method of providing raised contact portions on contact areas of an electronic microcircuit". A method of providing raised contact portions on contact areas of an electronic microcircuit in which a ball is formed at one end of a metal wire by means of thermal energy, the ball is pressed against a contact area of the electronic microcircuit and is connected to said contact area, a weakening being provided in the wire near the ball and the wire being severed at the area of the weakening.

398699

Affiliated with

Also associated with

Rating

Method of providing raised contact portions on contact areas... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of providing raised contact portions on contact areas..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of providing raised contact portions on contact areas... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1301378