Method of providing through hole plating between circuit...

Details Method of providing through hole plating between circuit... Method of providing through hole plating between circuit...

H - Electricity

05

K

356/18, 356/4

H05K 3/00 (2006.01) H05K 3/42 (2006.01)

Patent

CA 1200922

- 10 - METHOD OF PROVIDING THROUGH HOLE PLATING BETWEEN CIRCUIT ELEMENTS Abstract of the Invention: A method of providing through-hole plating between flexible circuit elements and rigid circuit elements is presented wherein a strong and reliable electrical connection is affected without damage to the conductive pattern of the flexible circuit elements. The method includes selectively providing removable masking material to portions of a flexible circuit element followed by nonelectrolytic plating and subsequent removal of the mask. An additional resist layer is also provided to selective areas followed by electrolytic plating and subsequent removal of the resist material.

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