B - Operations – Transporting – 23 – P
Patent
B - Operations, Transporting
23
P
B23P 11/00 (2006.01) B26F 1/02 (2006.01)
Patent
CA 2382350
A novel method is provided for forming a clear hole through a composite plate (20). A punching apparatus (48) is advanced through an extension skin of a first composite plate and a first skin (40) of a second composite plate, thereby compressing the core material of the second composite plate and forming a first slug (86). The apparatus is withdrawn therefrom. The composite plates are flipped over. The apparatus is advanced through a second skin (42) of the second composite plate, forming a second slug (95).
L'invention concerne un nouveau procédé permettant de perforer nettement un trou à travers une plaque composite (20). Ledit procédé consiste à mettre en contact un appareil (48) de perforation avec une peau supplémentaire d'une première plaque composite, et avec une première peau (40) d'une seconde plaque composite, comprimant ainsi la matière centrale de la seconde plaque composite et formant un premier rejet (86) de matière. On retire ensuite l'appareil et les plaques composites sont renversées. On met alors en contact l'appareil avec une seconde peau (42) de la seconde plaque composite, formant ainsi un second rejet (95) de matière.
Smart & Biggar
Wabash National L.p.
Wabash Technology Corporation
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