Method of removing particles from substrate surfaces

C - Chemistry – Metallurgy – 23 – C

Patent

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117/74, 204/74,

C23C 14/24 (2006.01) C23C 14/22 (2006.01) C23C 14/34 (2006.01) C23C 14/56 (2006.01) C23C 14/58 (2006.01)

Patent

CA 2008765

ABSTRACT: Method of removing particles from substrate surfaces. A method is described for the vacuum-coating of substrates, such as glass plates, foils, plastics substrates for optical discs etc., in which the substrates are introduced into a vacuum- coating arrangement and are vacuum-coated in accordance with a PVD (physical vapour-deposition) process such as for example cathode sputtering or vapour-deposition. In order to avoid pinholes in the coating the method is carried out in three steps, namely a first PVD step, in which the substrates and any particles adhering thereto are coated; a particle-displacement step in which the coated particles are displaced from their initial positions on the substrate; and an additional, second PVD step, in which the substrates are coated a second time to cover the defects formed in the coating by adhering particles in the first coating step.

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