Method of sawing crystalline rods, and multiple-blade...

Details Method of sawing crystalline rods, and multiple-blade... Method of sawing crystalline rods, and multiple-blade...

B - Operations, Transporting

26

D

239/2

B26D 3/16 (2006.01) B23D 59/00 (2006.01) B28D 5/00 (2006.01) B28D 5/02 (2006.01)

Patent

CA 1213865

METHOD FOR SAWING CRYSTALLINE RODS, AND MULTIPLE-BLADE INTERNAL-HOLE SAW FOR CARRYING OUT THE METHOD ABSTRACT Crystalline rods or blocks can be sawed into thin wafers by sawing the rod or block into a plurality of wafers that are connected to each other. The wafers can be connected by introducing a connecting agent after each sawing step, into the resulting cutting gaps. The wafers are separated only after the whole rod has been sawed. The method makes possible the use of multiple-blade internal-hole saws, and preferably two-blade internal-hole saws.

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