C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
C23C 26/00 (2006.01) C25D 11/18 (2006.01) G01N 27/02 (2006.01) G01R 27/26 (2006.01)
Patent
CA 2118391
Abstract of the Disclosure The specification describes and claims a method of bonding a sealant to an anodised aluminium surface the method comprising the steps of (1) measuring the electrical impedance of anodised aluminium substrates, (2) selecting at least one substrate having an electrical phase shift of from 0.4 to 0.5, (3) cleaning the anodised surface of the substrate, (4) applying to the anodised surface a curable silicone sealant composition and (5) bringing about curing of the sealant composition to form a bond between the anodised surface and the sealant.
Dow Corning S.a.
Gowling Lafleur Henderson Llp
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