Method of sealing electric and electronic parts

Details Method of sealing electric and electronic parts Method of sealing electric and electronic parts

B - Operations, Transporting

29

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358/22, 204/91.3

B29C 39/10 (2006.01) B29C 35/08 (2006.01) B29C 39/12 (2006.01) B29C 70/74 (2006.01) H01H 1/66 (2006.01) H01H 9/04 (2006.01) H01H 36/00 (2006.01)

Patent

CA 1265260

A method of sealing electric and electronic parts, comprising employing two different ultraviolet-curing resins for upper and lower layer portions, respectively, the resin employed for the upper layer portion having a smaller specific gravity than that of the resin for the lower layer portion before the resins are cured, and simultaneously curing the resins by irradiation with an ultraviolet ray. The ultraviolet-curing resin employed for the upper layer portion is an epoxy acrylate or epoxy resin, while an urethane acrylate ultraviolet-curing resin is employed for the lower layer portion, and the thickness of the ultraviolet-curing resin employed for the upper layer portion is set at from 0.5 mm to 3 mm.

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