Method of selecting a binder for a chipsealing process based...

Details Method of selecting a binder for a chipsealing process based... Method of selecting a binder for a chipsealing process based...

E - Fixed Constructions

01

C

E01C 19/21 (2006.01) E01C 7/35 (2006.01)

Patent

CA 2578087

A method of selecting a binder for a chipsealing process is provided. This method includes measuring the Adhesion Index of at least one binder and selecting a binder with a desirable Adhesion Index for the chipsealing process. The selected binder should have an Adhesion Index no greater than about 3.75 when calculated according to the most preferred method of the present invention. Preferably, the selected binder is applied to a surface and then aggregate is applied within the time parameters defined by the Adhesion Index of the binder to form a chipsealed surface. Preferably, substantially all of the aggregate bonds to the binder without the need for compacting the paved surface.

L'invention concerne un procédé de sélection d'un liant utilisé dans un processus d'agglomération. Ledit procédé consiste à mesurer l'indice d'adhérence d'au moins un liant, et à sélectionner un liant présentant un indice d'adhérence adapté pour être utilisé dans le processus d'agglomération. Le liant sélectionné doit présenter un indice d'adhérence ne dépassant pas 3,75 lorsqu'il est calculé selon le procédé de la présente invention. Le liant sélectionné est, de préférence, appliqué sur une surface, puis un granulat est appliqué dans les paramètres temporels définis par l'indice d'adhérence du liant pour former une surface agglomérée. Sensiblement tout le granulat se fixe au liant sans tassement de la surface pavée.

Affiliated with

Also associated with

Rating

Method of selecting a binder for a chipsealing process based... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of selecting a binder for a chipsealing process based..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of selecting a binder for a chipsealing process based... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1910992