Method of selectively depositing metal on a ceramic...

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B32B 3/08 (2006.01) C04B 41/51 (2006.01) C04B 41/88 (2006.01) C23C 14/04 (2006.01) G03F 7/00 (2006.01) H01L 21/48 (2006.01) H05K 3/22 (2006.01) H05K 3/24 (2006.01) H05K 1/03 (2006.01) H05K 1/09 (2006.01)

Patent

CA 1132857

METHOD OF SELECTIVELY DEPOSITING METAL ON A CERAMIC SUBSTRATE WITH A METALLURGY PATTERN ABSTRACT A liftoff process for selectively depositing additional metal layers on an existing metallurgy pattern supported on a dielectric substrate which includes the steps of (1) depositing a hardenable material on the dielectric substrate which has the characteristic of wetting the substrate surface, but not the existing metallurgy pattern, (2) heating the hardenable material to convert it to a liquid wherein the material is distributed to cover the dielectric substrate surface, but not the metallurgy pattern, (3) cooling the hardenable material to solidify it, (4) depositing a blanket layer of metal on the surface of the substrate, (5), dissolving the hardenable material in a suitable solvent thereby removing the material and the overlying metal layer portions.

341840

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