Method of separating a bonded film from a circuit board

Details Method of separating a bonded film from a circuit board Method of separating a bonded film from a circuit board

B - Operations, Transporting

29

C

154/1, 356/1, 35

B29C 63/00 (2006.01) H05K 3/00 (2006.01) H05K 3/12 (2006.01)

Patent

CA 2018223

ABSTRACT OF THE DISCLOSURE An apparatus for bonding a multi-layer thin film onto a substrate and for removing a layer of the film. A printed circuit board having a multi-layer film bonded to a planar surface thereof has one layer of the film lifted at a leading edge by vibration and fluid pressure. The leading edge is mechanically gripped and a pulling force applied thereto to draw the film from the surface of the circuit board and to transfer the removed film along a path to a discharge apparatus. The transfer apparatus includes frictionally engaged belts which direct the film along a transfer path to a source of ionized fluid which is applied to the film in order to remove static and direct the film along the transfer path towards a used film receptacle.

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