Method of severing smaller area semiconductor devices from a...

Details Method of severing smaller area semiconductor devices from a... Method of severing smaller area semiconductor devices from a...

H - Electricity

01

L

356/152, 345/22

H01L 21/34 (2006.01) H01L 21/302 (2006.01) H01L 31/20 (2006.01)

Patent

CA 1244558

ABSTRACT An improved method of severing a large area of an amorphous semiconductor device material into smaller area devices. The material includes an amorphous semiconductor body disposed between an electrically conductive substrate and a transparent electrically conducting coating. The transparent coating is brittle and upon severing can leave electrically conducting shards that short circuit the substrate to the coating. This problem is overcome by supporting the coating, either bare or with a protective member, which may be resilient, and applying a shearing force to the substrate. Cardboard, paper and polymers may be used as protective members.

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