C - Chemistry – Metallurgy – 22 – C
Patent
C - Chemistry, Metallurgy
22
C
113/86, 75/92
C22C 11/08 (2006.01) B23K 35/26 (2006.01)
Patent
CA 1077310
ABSTRACT OF THE DISCLOSURE A solder used for filling or padding operations on automobile bodies, consists essentially of 2.0-7.0 wt % antimony. and the balance of lead. This solder is inexpensive and exhibits good physical properties at high temperatures principally due to its high solidus temperature of above 240°C. The use of this solder is particularly advantageous when the filling or padding operations are preparatory to a surface coating operation in which a high baking temperature is employed for hardening enamel paint or varnish.
277716
Goto Norimasa
Kashiwaya Sadao
Nakao Hideo
Sugiyama Toul
Yoshida Elichi
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