Method of soldering a sputtering target to a backing member

Details Method of soldering a sputtering target to a backing member Method of soldering a sputtering target to a backing member

B - Operations, Transporting

23

K

B23K 1/08 (2006.01) B23K 1/00 (2006.01)

Patent

CA 2139221

A method of bonding a sputtering target (5) to a backing member or plate (7) for subsequent use in a sputtering operation. A target (5) and a backing plate (7) are first provided and one face of each of the target (5) and backing plate (7) are wetted with solder. The target (5) and backing plate (7) are then submerged in a solder bath (11), and the wetted faces of the target (5) and backing plate (7) are pressed into contact. The target (5) and backing plate (7) are then removed from the solder bath (11) and while maintaining them pressed together, the solder interface (15) therebetween is cooled directionally by causing cooling to occur from the center of the solder interface (15) radially outwardly toward the periphery. The lowermost of the target and backing plate is provided with a circumferential lip (6) adjacent the periphery of the solder interface (15). When the target (5) and backing plate (7) are removed from the solder bath (11) the lip (6) acts as a solder collector and provides a solder reservoir (20) for supply- ing the periphery of the solder interface (15) with solder as the solder interface (15) is cooled.

Affiliated with

Also associated with

Rating

Method of soldering a sputtering target to a backing member does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of soldering a sputtering target to a backing member, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of soldering a sputtering target to a backing member will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1410457