Method of structuring thin layers

Details Method of structuring thin layers Method of structuring thin layers

H - Electricity

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H01L 21/18 (2006.01) G03F 7/11 (2006.01) G03F 7/40 (2006.01) G03F 7/42 (2006.01) H01L 21/00 (2006.01) H01L 23/29 (2006.01) H05K 3/04 (2006.01)

Patent

CA 1046648

ABSTRACT: A method of structuring oxide layers, nitride layers or magnetic layers in such manner that a photo- lacquer mask is manufactured on a substrate and the layer to be structured is provided by means of cathode sputter- ing both on the photolacquer mask and on the surfaces of the substrate not covered with lacquer. The substrate is then treated with a solvent attacking the lacquar mask; the mask swells up and the parts of the layer to be structured present thereon are chipped off. In order to stimulate this latter process, a layer is provided below the photolacquer mask on the substrate relative to which photolacquer has a small adhesive capacity and, after providing the layer to be structured, an increase in volume of the lacquer mask is produced by thermal treat- ment. After the complete removal of the photolacquer mask and the parts of the layer to be structured present thereon, the structured thin layer remains on the sub- strate as a negative of the pattern of the photolacquer mask.

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