B - Operations – Transporting – 64 – G
Patent
B - Operations, Transporting
64
G
26/29
B64G 1/44 (2006.01) B23K 1/20 (2006.01) B23K 20/18 (2006.01) B23K 20/20 (2006.01) B64G 1/64 (2006.01) B64G 1/22 (2006.01)
Patent
CA 1250734
ABSTRACT OF THE DISCLOSURE A method is provided of temporary assembling by soldering of peel off plates through soldering material and a flexible junction element for a mechanical release device to release two parts temporarily fixed edgewise by peeling off the flexible element and the soldering material. There is provided on the plates and flexible junction element re- served areas without any adherence to the soldering material, and pre- ferably at the limits of said reserved areas, trap means for removing any excess of soldering material, and the melting solder material is put under load for distributing it between the plates and the flexible junction element, A so obtained assembly can be applied particularly to obtain automatic opening of containers in particular in space for spreading out solar panels.
467500
Aerospatiale Societe Nationale Industrielle
Riches Mckenzie & Herbert Llp
LandOfFree
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