Method of thickness control for dies

Details Method of thickness control for dies Method of thickness control for dies

B - Operations, Transporting

29

C

B29C 47/16 (2006.01)

Patent

CA 2136932

An easily controllable method to adjust the die slot 44 exit 46 gap to produce an accurately controlled flow from the slot exit across the width of a die 30 provides movable back seats 40 at the back of the die that cause the front and back portions of the die plates to move simultaneously to produce a change in the die slot exit gap. At least one actuator 56 is located between the front and back seats 38, 40 of the die to increase or reduce its length to bend the first plate 34, 36 around the front seat 38 thereby to increase or decrease the first exit gap.

Affiliated with

Also associated with

Rating

Method of thickness control for dies does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of thickness control for dies, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of thickness control for dies will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1637842