Method of tuning apparatus by low power laser beam removal

Details Method of tuning apparatus by low power laser beam removal Method of tuning apparatus by low power laser beam removal

H - Electricity

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P

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H01P 3/08 (2006.01) H01L 21/268 (2006.01) H01L 27/01 (2006.01) H01P 1/205 (2006.01) H01P 11/00 (2006.01) H05K 1/00 (2006.01) H05K 1/03 (2006.01) H05K 3/02 (2006.01) H05K 3/38 (2006.01)

Patent

CA 1145858

ABSTRACT A method of tuning an apparatus for use in communications equipment which comprises providing a non-conductive wafer; providing on a first major surface of the wafer at least one conductive circuit element; providing on the second major surface of the substrate a relatively large conductive area having generally a first predetermined thickness and having, opposite the at least one circuit element, a portion of a second predetermined thickness, the second predetermined thickness being substantially thinner than the first predetermined thickness; and evaporating appropriate portions of the thinner portion of the large conductive area by means of a low-power laser beam having sufficient energy to evaporate the thinner portions of the conductive areas on the second major surface and insufficient energy to evaporate the thicker portions; thereby altering the capacitance between the conductive elements on the opposing sides of said wafer.

360829

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