Method of welding of connection wires to microcircuit contacts

Details Method of welding of connection wires to microcircuit contacts Method of welding of connection wires to microcircuit contacts

B - Operations, Transporting

23

K

327/45

B23K 9/16 (2006.01) H01L 21/60 (2006.01) H01L 21/603 (2006.01) H01L 21/607 (2006.01)

Patent

CA 1178664

PHN.9872 10 27.4.81 ABSTRACT "Method of forming a wire bond" A method of forming a wire bond between a contact place on an electronic microcircuit (17) and a connection conductor (18), in which a wire (6) of aluminium or an aluminium alloy is used which is passed through a capillary (5) in which a ball is formed at the end of the wire by means of a spark discharge between the wire (6) and an electrode (11), which spark discharge takes place in a protective gas atmosphere in which a first electric spark discharge is produced between two auxiliary electrodes (12, 13) as a result of which the protective gas is ionised and a plasma is formed, after which due to the low resistance in the plasma an electric spark discharge takes place between the electrode (11) and the wire (6) at a voltage between 25 V and 200 V, by which spark discharge a ball is formed at the end of the wire, while the wire is then bonded to a contact place on the electronic microcircuit and then to the connection conductor by means of a capillary.

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