Method/system measuring object features with 2d and 3d...

Details Method/system measuring object features with 2d and 3d... Method/system measuring object features with 2d and 3d...

G - Physics

02

B

G02B 26/10 (2006.01) G01B 11/03 (2006.01) H01L 21/66 (2006.01)

Patent

CA 2375741

A system and method are disclosed for highly efficient imaging of selected object features utilizing, in combination, a 2D imaging subsystem (100) and a 3D imaging subsystem (110) wherein data from the 2D imaging subsystem (100) is used to predetermine areas containing 3D features of interest such that delay attributable to imaging of areas of non-interest for 3D features is minimized.

L'invention concerne un système et un procédé destinés à une imagerie haut rendement de caractéristiques sélectionnées d'un objet au moyen d'une combinaison d'un sous-système d'imagerie en 2D (100) et d'un sous-système d'imagerie en 3D (110) dans lesquels les données provenant du sous-système d'imagerie en 2D (100) sont utilisées pour prédéterminer les zones contenant des caractéristiques d'intérêt en 3D, ce qui permet de réduire au minimum le retard dû à la formation d'images des zones n'offrant aucun intérêt au niveau des caractéristiques en 3D.

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