Method to ensure the cooling of electronic components fixed...

Details Method to ensure the cooling of electronic components fixed... Method to ensure the cooling of electronic components fixed...

H - Electricity

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H05K 1/00 (2006.01) H05K 1/02 (2006.01) H05K 3/00 (2006.01) H05K 7/20 (2006.01) H05K 1/05 (2006.01) H05K 3/44 (2006.01)

Patent

CA 1263196

A B S T R A C T The method ensures the cooling of electronic components fixed on a multilayer, with at least a metal layer interposed between insulating layers, through successive steps for the obtaining of seats or cavities or through-holes with metallized surface, the seats or cavities having the bottom formed by said metal layer and the through-holes being formed in the vicinity of the same seats; the cooling of the component is achieved by heat conduction along said metal layer, or by dissipator means located outside the multilayer and in thermal conductivity connection with said metal layer.

511103

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