Methods and apparatus for deposition of thin films

C - Chemistry – Metallurgy – 23 – C

Patent

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C23C 16/00 (2006.01)

Patent

CA 2518421

A method for depositing a thin film includes the steps of providing a vapor including at least one selected vapor phase component into an evacuated chamber and condensing the vapor onto a heated substrate to form a liquid phase deposit wherein a temperature of the substrate is lower than the condensation temperature of the component. The liquid deposit is then cooled to produce a solid phase film. The invention can provide two or more vapor phase components. The invention can be used to deposit a wide variety of layers, including thin films of metallic, semiconductor and nonmetallic inorganic materials. The invention is useful for forming solid electrolytes and the electrodes for batteries, fuel cells and other electromagnetically active devices.

L'invention concerne un procédé permettant de déposer un film mince et comprenant les étapes consistant à placer de la vapeur comprenant au moins un composant en phase de vapeur sélectionné dans une chambre sous vide et à condenser la vapeur sur un substrat chauffé, de manière à former un dépôt en phase liquide, la température du substrat est inférieure à la température de condensation du composant. Le dépôt de liquide est ensuite refroidi, de manière à obtenir un film en phase solide. Le procédé selon l'invention peut utiliser au moins deux composants en phase vapeur et il peut être mis en oeuvre pour déposer une large palette de couches, notamment des films minces de matériaux inorganiques métalliques, semi-conducteurs ou non métalliques. Le procédé selon l'invention permet de former des électrolytes solides et les électrodes pour des batteries, des piles à combustibles et d'autres dispositifs actifs sur le plan électromagnétique.

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