Methods and apparatus for emi shielding

Details Methods and apparatus for emi shielding Methods and apparatus for emi shielding

H - Electricity

05

K

H05K 9/00 (2006.01)

Patent

CA 2401168

Disclosed are methods for manufacturing electromagnetic interference shields for use in nonconductive housings of electronic quipment. In one embodiment, the shield may include an electrically nonconductive substrate, such as thermoformable film, coated with an electrically conductive element, such as an extensible ink or a combination of conductive fibers with an extensible film. In one embodiment, a compressible conductie perimeter gap gasket may be formed by using a form in place process.

La présente invention concerne des procédés de fabrication de dispositifs d'antiparasitage destinés à des carters non conducteurs d'équipements électroniques. Selon un mode de réalisation, le blindage peut être constitué d'un substrat non électro-conducteur tel qu'un film thermoformable, revêtu d'un élément électro-conducteur tel qu'une encre extensible ou de fibres électro-conductrices associées à un film extensible. Selon un mode de réalisation, pour former le joint d'intervalle compressible à périmètre électro-conducteur, on peut procéder par mise en forme en place.

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