Methods and apparatus for holding and positioning...

Details Methods and apparatus for holding and positioning... Methods and apparatus for holding and positioning...

H - Electricity

01

L

H01L 21/00 (2006.01) C25D 7/12 (2006.01) H01L 21/288 (2006.01) H01L 21/321 (2006.01) H01L 21/687 (2006.01)

Patent

CA 2352160

A wafer chuck assembly for holding a wafer during electroplating and/or electropolishing of the wafer includes a wafer chuck for receiving the wafer. The wafer chuck assembly also includes an actuator assembly for moving the wafer chuck between a first and a second position. When in the first position, the wafer chuck is opened. When in the second position, the wafer chuck is closed.

L'invention concerne un ensemble support de tranche destiné à servir de support à une tranche lors de son polissage électrolytique et/ou de son placage par électrodéposition. L'ensemble support de tranche comprend également un ensemble d'actionnement permettant de déplacer le support de tranche entre une première et une deuxième position. Lorsqu'il se trouve dans la première position, le support de tranche est ouvert. Lorsqu'il se trouve dans la deuxième position, le support de tranche est fermé.

Affiliated with

Also associated with

Rating

Methods and apparatus for holding and positioning... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods and apparatus for holding and positioning..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods and apparatus for holding and positioning... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-2019328