Methods and apparatus for patterning a surface

B - Operations – Transporting – 44 – C

Patent

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Details

B44C 1/22 (2006.01) B41M 3/00 (2006.01) G03F 7/00 (2006.01) H01L 51/40 (2006.01)

Patent

CA 2460862

The present invention provides methods and apparatus for locally patterning surfaces. In one such method, an oxidizable thioether is adsorbed onto a conductive surface (10). The surface is then contacted with a fluid medium (M). A conducting stamp (12) is then brought into contact with the fluid medium above the thioether-coated surface. Next, a potential (V) is applied between the stamp and the surface. It is expected that the charge will be transferred through the medium to the coated surface along a shortest distance path, thereby locally oxidizing the thioether and effectively creating a negative patterned image of the conducting stamp on the surface. Remaining adsorbed thioether may then be used as a mask for standard etching or material addition procedures.

L'invention concerne des procédés et un appareil pour la formation locale de motifs sur des surfaces. Selon ledit procédé, un thioéther oxydable est adsorbé sur une surface conductrice, après quoi la surface est mise en contact avec un milieu fluide. Un tampon conducteur est ensuite mis en contact avec le milieu fluide, au-dessus de la surface revêtue de thioéther. Un potentiel est appliqué entre le tampon et la surface. La charge est censée être transférée à travers le milieu jusqu'à la surface revêtue, en suivant le chemin le plus court, ce qui oxyde localement le thioéther et crée efficacement sur la surface une image à motifs négative du tampon conducteur. Le thioéther adsorbé restant peut ensuite être utilisé en tant que masque pour des procédures standard d'attaque ou d'addition de matières.

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